Products

Characteristic

Remarks

HiReact® DICY

Dicyandiamide

Micropulverised Dicyandiamide

HiReact® DICY(A)

Dicyandiamide

Micropulverised Dicyandiamide with anticaking agent

HiReact® LC-779

Accelerated Dicyandiamide

Accelerated Dicyandiamide- Medium- cure speed

HiReact® LC-780

Accelerated Dicyandiamide

Accelerated Dicyandiamide- Fast cure speed

HiReact® LC-780(S)

Accelerated Dicyandiamide

Accelerated Dicyandiamide- Low temp & Fast cure speed

Products

Characteristic

Remarks

HiReact® MI35

Amine adduct  based on 2-methyl imidazole

MI35 acts as accelerator for epoxy powder coating cured by phenolic hardener. a typical application is for coating rebar steel and pipelines.

HiReact® MI50

Amine adduct  based on 2-methyl imidazole

MI50 acts as accelerator for epoxy powder coating cured by phenolic hardener. a typical application is for coating rebar steel and pipelines.

HiReact® MI

2-methyl imidazole

MI acts as accelerator for epoxy powder coating cured by phenolic hardener.

HiReact® MI-FF

2-methyl imidazole with anticaking agent

MI FF acts as accelerator for epoxy powder coating cured by phenolic hardener.

HiReact® MI-CA

Isocyanuric Acid adduct  based on 2-methyl imidazole

MI CA acts as accelerator for epoxy powder coating cured by phenolic hardener.

Products

Characteristic

Remarks

HiReact® T-03

Dicyandiamide

T03 is hardener for epoxy resin based on Dicyandiamide which is specially made for the production of prepregs in the printed circuit boards industry.

HiReact® G-03

Dicyandiamide

G03 is hardener for epoxy resin based on Dicyandiamide which is specially made for the production of prepregs in the printed circuit boards industry

Products

Characteristic

Remarks

HiReact® L-10

Solution of Dicyandiamide

This solution of Dicyandiamide is used for curing epoxy resins at elevated temperatures..